Conmoly | CM-POWER-FILM | High-Temperature Capacitor Films
Shenzhen Xinju New Materials Technology Co., Ltd.
https://conmoly.com

Selection reference; third-party published figures are not Conmoly guaranteed specifications or certifications. Final specifications require configuration review. Images illustrate product form.
Reference configuration: Low-loss engineered fluoropolymer film for aerospace power electronics and harsh-environment capacitors, maintaining voltage and capacitance stability under heat, field stress and long energized duty.

These are high-temperature capacitor-film material properties; finished-capacitor values still depend on metallization, winding and package design.
Temperature range: −55 to +200 °C | Film material
Material construction: Engineered fluoropolymer | Material system
Film thickness: 4 μm | Standard value
Dielectric constant: 2.1 | Material property
Loss tangent: 0.0002 | Tanδ
Insulation resistance: 7,000,000 MΩ × μF | At 25 °C
Source: https://www.gore.com/products/high-temperature-capacitor-films

Aerospace power electronics: For high-power-density inverter, power-module and DC-link capacitor directions.
High-temperature industrial: For long-life systems with limited cooling or elevated ambient temperature.
Custom wound element: Film and metallization are defined by capacitance, voltage, width and package.
Functional film: Engineered fluoropolymer film forms the low-loss dielectric core.
Metallized electrodes: Metal layers are defined around capacitance, current density and self-healing.
Winding or stack: Tension, alignment and edge control maintain thickness and field consistency.
End connection: Low-resistance interfaces control pulse current and localized heating.
Package system: Potting, enclosure and thermal path support vibration and elevated temperature.
Electrical target: Capacitance, working voltage, ripple current and peak power
Thermal boundary: Continuous temperature, hot spots and thermal cycling
Loss target: Dielectric loss, ESR and allowable temperature rise
Mechanical envelope: Film thickness, winding size, package and mass
Manufacturing: Metallization, winding, end spray and encapsulation
Life validation: Voltage, temperature, vibration and capacitance drift

Dielectric constant, loss tangent and insulation resistance
High-temperature voltage and capacitance stability
Electrical comparison after thermal cycling, vibration and shock
Long-duration energized, ripple and accelerated-life testing
Aerospace and defense power electronics
High-temperature inverter and DC link
Downhole tools
High-reliability pulse and filter capacitors
Wound or stacked capacitor element
Custom width, thickness and roll diameter
Busbar, lead or module termination
Film values are material-level data. Finished-capacitor capability also depends on metallization, winding, package, cooling and electric-field design.