Conmoly | CM-DATA-FLAT | High-Speed Flat Data Cables
Shenzhen Xinju New Materials Technology Co., Ltd.
https://conmoly.com

Selection reference; third-party published figures are not Conmoly guaranteed specifications or certifications. Final specifications require configuration review. Images illustrate product form.
Reference configuration: High-speed flat data cable for semiconductor and precision-motion equipment, supporting directions through 1 GHz and Ethernet, FireWire, USB and CoaXPress with more than 10 million flex cycles at a 50 mm dynamic bend radius and an ISO Class 1 cleanroom direction.

Flex life and cleanliness are affected by stroke, bend radius and acceleration and should be validated against the application.
Maximum frequency: 1 GHz | High-speed flat data cable
Dynamic flex life: > 10 million cycles | Standard test condition
Minimum dynamic bend radius: 50 mm | Dynamic bend condition
Cleanroom rating: ISO Class 1 | Cleanroom application configuration
Supported protocols: Ethernet · FireWire · USB · CoaXPress | Cable-construction dependent
Source: https://www.gore.com/products/high-speed-flat-data-cables-semiconductor

High-speed differential flat cable: Positions Ethernet or USB differential units to manage impedance, crosstalk and dynamic skew.
Machine-vision flat cable: Integrates CoaXPress or other camera-signal units while preserving geometry through repeated travel.
Data-and-power hybrid flat cable: Combines FireWire, control or low-voltage power units to reduce cable count on moving stages.
Signal conductors: Parallel positions are defined from channel count, current and signal integrity.
Low-loss insulation: Controls impedance while supporting a thin flexible profile.
Shield architecture: Pair, zone or overall shields manage crosstalk and external noise.
Flat reinforcement: Controls neutral axis, conductor migration and planar flex.
Clean outer surface: Supports equipment routing and selected cleanliness requirements.
Signal set: Channel count, protocol, impedance and data rate
Geometry: Pitch, width, thickness and bend direction
Motion: Stroke, radius, speed, acceleration and cycle target
Clean environment: Cleanroom class direction, particles, ESD and vacuum
Termination: Connector pitch, contact map and strain relief
Installation: Guide surfaces, free length, clamps and service access
CM-FLAT-DATA-1G | Ethernet / USB · up to 1 GHz | Parallel differential units, zoned shielding and low-particle surface | > 10 million cycles · 50 mm dynamic bend radius | High-speed stages, metrology and data acquisition
CM-FLAT-VISION | CoaXPress / camera-data direction | Video-signal units with flat reinforcement and slip layers | ISO Class 1 cleanroom direction | Machine vision, wafer inspection and high-speed imaging
CM-FLAT-HYBRID | FireWire / data plus low-voltage power | Zoned data, control and power units | Validate crosstalk, voltage drop and flex life together | Wafer handling, motion control and multifunction stages
Solution codes support early protocol, motion and cleanliness matching. Final part number, flat dimensions, channel layout, termination and life conditions are confirmed against equipment stroke and test specification.
Impedance, insertion loss, crosstalk and channel skew
Dynamic planar-flex cycling
Particle/ESD/vacuum tests when project-defined
Connector, clamp and termination retention
Semiconductor process equipment
High-speed stages and inspection
Machine vision and camera modules
Cleanroom automation and measurement
Fine-pitch board and equipment connectors
Custom flat-cable terminations
Breakout and transition assemblies
Cleanroom class, flex life and protocol performance depend on materials, stroke, bend radius, speed and acceleration and require validation on the installed motion profile.