Conmoly | CM-DATA-CLEAN | Ultraclean Static Round Cables
Shenzhen Xinju New Materials Technology Co., Ltd.
https://conmoly.com

Selection reference; third-party published figures are not Conmoly guaranteed specifications or certifications. Final specifications require configuration review. Images illustrate product form.
Reference configuration: ISO Class 1 static round cable for lithography and precision semiconductor tools, combining signal and power cores while controlling particles and vacuum outgassing.

Temperature and bend requirements depend on the equipment application; outgassing values are shown by test species.
Cleanroom class: ISO Class 1 | ISO 14664-1
Temperature range: −20 to +260 °C | Application dependent
Minimum bend radius: > 10× OD | Static round cable
Core types: Signal + power | Custom combination
H₂O outgassing: 6.00E−10 mbar·l/s·cm² | AMU 18
Volatile CxHy outgassing: 2.00E−12 mbar·l/s·cm² | AMU 45–100
Nonvolatile CxHy outgassing: 5.00E−13 mbar·l/s·cm² | AMU 101–200
Source: https://www.gore.com/products/ultra-clean-round-cables

Static signal cable: Control and sensor connection inside clean equipment.
Static power cable: Defined around current, temperature rise and material restrictions.
Terminated assembly: Combines equipment connector, route and clean assembly process.
Silver-plated copper-alloy conductors: Gauge, voltage drop, strength and termination contacts define the conductor construction.
Low-loss insulation: Expanded PTFE/PTFE controls impedance, delay and high-frequency attenuation.
Controlled signal units: Differential pairs, quads or multichannel video/data units are formed around the protocol.
Individual and overall shields: Pair coupling, external EMI and connector return continuity are managed together.
Environmental jacket: Wide temperature, abrasion, flame, marking and harness termination are balanced.
Protocol and speed: Interface revision, target rate, encoding and maximum channel length
Electrical boundary: Impedance, insertion/return loss, skew and dielectric withstand
Channel construction: Pair count, auxiliary wires, power and shield zoning
Installation envelope: Gauge, diameter, mass, bend radius and harness section
Environment: Temperature, vibration, abrasion, fluids, smoke/toxicity and flame
Termination: Connector, contact, backshell, grounding and strain relief

Impedance, insertion/return loss, crosstalk and skew
Continuity, wire map, dielectric withstand and insulation resistance
Temperature, vibration, abrasion, flex and termination retention
Full-channel test at target protocol, length and connector configuration
Lithography tools
Wafer metrology and inspection
Vacuum and ultraclean equipment
Precision semiconductor motion systems
Aerospace circular or rectangular connectors
High-density contacts and backshells
Pigtail, fixed-length harness or complete assembly
Data rate and channel capability depend on the final cable, length, connectors and termination process and must be confirmed as a complete channel.