CONMOLY / ENGINEERING & CONNECTIVITY
Reference configuration: Low-loss engineered fluoropolymer film for aerospace power electronics and harsh-environment capacitors, maintaining voltage and capacitance stability under heat, field stress and long energized duty.
Power Enablers
CM-POWER-FILM
Capacitor Films
Reference configurations only; specifications and certifications require confirmation.
Selection reference. Published third-party figures below describe specific reference configurations; they are not Conmoly guaranteed values or certifications. Confirm the final construction and test requirements with engineering.
These are high-temperature capacitor-film material properties; finished-capacitor values still depend on metallization, winding and package design.
Scroll the table horizontally to view all configuration conditions.
| Parameter | Reference value | Configuration / condition |
|---|---|---|
| Temperature range | −55 to +200 °C | Film material |
| Material construction | Engineered fluoropolymer | Material system |
| Film thickness | 4 μm | Standard value |
| Dielectric constant | 2.1 | Material property |
| Loss tangent | 0.0002 | Tanδ |
| Insulation resistance | 7,000,000 MΩ × μF | At 25 °C |
Reference source: www.gore.com
| Aerospace power electronics | For high-power-density inverter, power-module and DC-link capacitor directions. |
|---|---|
| High-temperature industrial | For long-life systems with limited cooling or elevated ambient temperature. |
| Custom wound element | Film and metallization are defined by capacitance, voltage, width and package. |
| Functional film | Engineered fluoropolymer film forms the low-loss dielectric core. |
|---|---|
| Metallized electrodes | Metal layers are defined around capacitance, current density and self-healing. |
| Winding or stack | Tension, alignment and edge control maintain thickness and field consistency. |
| End connection | Low-resistance interfaces control pulse current and localized heating. |
| Package system | Potting, enclosure and thermal path support vibration and elevated temperature. |
| Electrical target | Capacitance, working voltage, ripple current and peak power |
|---|---|
| Thermal boundary | Continuous temperature, hot spots and thermal cycling |
| Loss target | Dielectric loss, ESR and allowable temperature rise |
| Mechanical envelope | Film thickness, winding size, package and mass |
| Manufacturing | Metallization, winding, end spray and encapsulation |
| Life validation | Voltage, temperature, vibration and capacitance drift |
Film values are material-level data. Finished-capacitor capability also depends on metallization, winding, package, cooling and electric-field design.
Reference configuration: Temperature-resistant, chemically inert and abrasion-resistant engineered fluoropolymer insulation supports stable high-voltage, lightweight and long-term material reliability in current and next-generation aircraft electrical systems.
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Reference configuration: Engineered fluoropolymer insulation protects copper windings and maintains insulation resistance and breakdown performance in high temperature, high pressure, oil and hydrolysis environments.
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Reference configuration: High-voltage, wide-temperature, low-springback feeder paths for aircraft main power and electrification systems, controlling partial discharge, thermal aging, abrasion and constrained routing.
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